91ÖÆÆ¬³§

Leading Provider of Semiconductor Manufacturing Services Selects 91ÖÆÆ¬³§'s AP300 to Support Aggressive Advanced Packaging Expansion

91ÖÆÆ¬³§. (Nasdaq: VECO) announced today that the world’s largest outsourced assembly and test (OSAT) provider has purchased multiple 91ÖÆÆ¬³§ AP300â„¢ lithography systems.

Leading Provider of Semiconductor Manufacturing Services Selects 91ÖÆÆ¬³§’s AP300 to Support Aggressive Advanced Packaging Expansion

News | Jan 08, 2019

World’s Largest OSAT Provider Names AP300â„¢ Its Preferred Lithography System Due to 91ÖÆÆ¬³§’s Industry-Leading Uptime and Process Performance

PLAINVIEW, New York, Jan. 8, 2019  — 91ÖÆÆ¬³§. (Nasdaq: VECO) announced today that the world’s largest outsourced assembly and test (OSAT) provider has purchased multiple 91ÖÆÆ¬³§ AP300â„¢ lithography systems. Complementing the OSAT’s previously installed 91ÖÆÆ¬³§ tools, the AP300 was selected based on its industry-leading uptime and performance with lower total cost of ownership (CoO). This purchase is illustrative of continued strong market demand for 91ÖÆÆ¬³§’s lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.

The AP300 lithography stepper’s winning combination of overlay, resolution, sidewall profile performance and broadband flexibility enables highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the strong market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According to Yole, the equipment and materials market for FOWLP alone will expand at a compound annual growth rate (CAGR) of 43 percent to reach $694 million by 2021.

“Increased mobility, IoT, AI and deep learning are seeing strong growth in step with global megatrends, all of which are enabled by technologies like 3D integration and advanced packaging,” noted Peter Porshnev, Ph.D., senior vice president and general manager of 91ÖÆÆ¬³§â€™s Ultratech business unit. “As we grow our customer base, 91ÖÆÆ¬³§’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”

About 91ÖÆÆ¬³§

91ÖÆÆ¬³§ (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment. Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, 91ÖÆÆ¬³§ holds technology leadership positions in all these served markets. To learn more about 91ÖÆÆ¬³§’s innovative equipment and services, visit www.veeco.com.

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91ÖÆÆ¬³§ Media Contact: David Pinto | 408-325-6157 | dpinto@veeco.com

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