91ÖÆƬ³§

AP200/300 Lithography Systems

AP200/300 Projection Steppers

The AP200/300 family of lithography systems is built on 91ÖÆƬ³§â€™s customizable Unity Platformâ„¢, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost- effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment and Optical focus.

Key Features

• 2 µm resolution broadband projection lens designed for Advanced Packaging applications
  • Exposure wavelength from 350 – 450 nm to handle a wide range of Advanced Packaging photosensitive materials
  • Programmable wavelength selection (GHI, GH, I) for process optimization and process latitude
  • High intensity illumination provides superior system throughput
  • Large Depth-of-Focus for thick resist processes and large wafer topography

• High system throughput for favorable system cost of ownership

• • High intensity illumination reduces exposure time
  • Field size of 68 by 26mm exposes two scanner fields, reducing number of exposure steps per wafer
  • Fast system stage and wafer input/output systems to minimize handling time

• Flexible Alignment system with self metrology capability

• • Patented Machine Vision System (MVS) alignment capability eliminates the need for dedicated alignment targets and simplifies process integration
  • IR alignment system for Through Silicon Vias and 3D packaging using embedded/buried target capture
  • Stepper Self Metrology (SSM) for optimizing product overlay

• Advanced Packaging Specific Features

• • Wafer Edge Exposure and Wafer Edge Exclusion capabilities for electroplating processes
  • Warped Wafer Handling up to 7mm for Fan-Out applications
  • Universal Wafer Handling without hardware conversion (8 and 12 inch; or 6 and 8 inch)
  • Field stitching software to fabricate large area interposers

• Complete SECS/GEM software package supports production automation and equipment/process tracking

Device Applications:

• Advanced Packaging
• LED
• MEMS
• Power Devices

AP200/300 Application Suite:

• Redistribution Layers
• Micro-pillars
• Through-Silicon Via

91ÖÆƬ³§ is Making a Material Difference with AP Lithography:

• Industry-Leading warped wafer handling
• Optical focus capability
• CD Uniformity Superior line resolution for the most advanced L/S
• Leading installed-base and proven high-volume production